Machinery and Capabilities


PCB Backing Oven

Mazzali THERMAIR

– chamber 500x500x800mm
MPM Industries TYPE M120
– chamber 600x500x500

LABELING

Labeling Station ROMMEL WL2001 T

-T hermal transfer printer 600 dpi
– Labeling area (LxW) 440×460 mm

SMT LINES

3 x FUJI lines:

– 40k comp/h- max pcb area 584×508 mm
– BGA 44×44 mm
– 10 zones oven with N2

Universal line:

– Dual Configuration

– 70k comp/h- max pcb area 381×457 mm
– 0201 min component
– 10 zones oven with N2

2 x HITACHI lines:

– 80k comp/h- max pcb area 460×460 mm
– BGA 44×44 mm- 0201 min component
-10 zones oven with N2

A.O.I.

SAKI BF FRONTIER  and VI Technology 3000 in-line on SMT lines

– Line scan technology
– Max resolution 18 μm
– Max working area 460×500 mm
– Data acquisition for external repairVI Technology 3000 In-line on SMT lines
– Max working area 405×397 mm- Vision System: Vectorial Imaging
– Inspection Time per part: 4-20ms
– Camera Field Size:40.96mm x 32.768mm

REWORK

2 x OKI APR 5000 XLS rework station

– B.G.A. Rework station

X-RAY

2 X-RAY Inspection 0,5 µm

– GE micromexPhoenix

SELECTIVE SOLDERING

SOLTEC mySelective 6749

– MultiWave Solder Pot
– X/Y fluxer
– Automatic solder frame reflow

COATING

ASYMTEC: SL-940 and C-740 Selective varnish dispensing systems

– Dual film coater module
– Continuous viscosity control
– Dispensing area 400 x440x70 mm
– Max dispensing speed 1000 mm/s
– Automatic fan width control

CUSTOMIZED PTH A.O.I.

Automatic Optical Inspection System designed by dm elektron

– 5Mpx camera
– 200x200mm camera field area
– Custom programmable
– Stand-alone or in-line

AUTOMATIC PTH ASSEMBLY LINE

Custom ODD Shape assembly line

– 2 x Pick&Place cell with
custom feeder and automatic
tooling change
– 1 x Programmable Soldering cell soldering iron based
– Point-to-point selective soldering
– Loader, unloader and FIFO buffer
– In-line selective soldering
– In-line depaneling router

PTH ASSEMBLY LINE

SEHO PowerWave N2 In-line

– Simultaneously multi product management
– Nitrogen closed-in tunnel
– Spray fluxer with HVLP technology 1800mm preheating area
– Programmable soldering area
– Solder frames with transponder system for automatic program change
– Feed-in conveyor line
– Feed-out conveyor line with
automatic distribution of different products related to different
workspaces

TESTING

A.O.I. of PCB – Visper 530

– Automatic inspection even for large
-size PCBs.
– Higher detection power and fast inspection speed.Inspection with full-colored line sensor system

Metallographic Microsection

– Base layer thickness measurement
– Copper layer thicknessmeasurement- PCB specification report

Flying Probe Test – SPEA 4040

– Wide test area: 686 x 610 mm
– SMART In-Circuit Test
– Nodal Impedance Test (NZT)
– Short test based on nodalimpedance measurement
– On-Board Programming
– Optical Test- Boundary Scan

In Circuit Test- TERADYNE Test Station LH

– In-Circuit Analog Module (ICA)
– High Voltage Source ±120 Vdc
– IEEE/GPIB Controller
– Real Time Data Acquisition
– Multiplexed or non-multiplexedarchitecture
– Supports in-circuit programmingof ISP and FLASH devices

Climatic & Thermostatic  Chambers

– Angelantoni sunrise chambers

Run-in Test Bench

Automatic and manual dielectric Test Equipment

Automatic Functional Test  Equipment

– Remote data collection
– Tailor made test for load andsignal card developed andbuilt by dm elektron